FCCL
 
JUJIA KOREA
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FCCL
Flexible Cupper Clad Laminate
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LCP-FCCL은 접착제 없이 특수한 공법으로 동박을 부착하였으므로
유전손실율에 영향을 받지않는 저유전 소재로서
고속통신이 가능하여, 스마트폰 / 태블릿PC / 자동차 전장 등
다양한 전자제품에 사용되는 FPCB의 핵심소재입니다.
LCP-FCCL 데이터
Category Single side fccl Double side fccl
Properties Test Condition Unit Applicable
Standard		 LRB1J250-
S05012E		 LRB1J250-
S07512E		 LRB1J250-
S10012E		 HRB1P250-
D05012E		 HRB1P250-
D07512E		 HRB1P250-
D10012E		 HRB1P250-
D12512E
Composition - - - LCP 50um LCP 75um LCP 100um
ED Copper 12um ED Copper 12um ED Copper 12um ED Copper 12um
LCP 50um LCP 75um LCP 100um LCP 125um
ED Copper 12um ED Copper 12um ED Copper 12um ED Copper 12um
ED Copper 12um ED Copper 12um ED Copper 12um
Products
thickness 		- μm IPC TM-650
2.2.18 		50±3 75±3 100±3 50±3 75±3 100±3 125±6
Chemical
Resistance 		2mol/L HCL - IPC TM-650
2.4.13 		Pass Pass Pass Pass Pass Pass Pass
2mol/L
NAOH 		- Pass Pass Pass Pass Pass Pass Pass
IPA - Pass Pass Pass Pass Pass Pass Pass
Peel Strength 90° N/mm IPC TM-650
2.4.9B 		≥0.65 ≥0.65 ≥0.65 ≥0.65 ≥0.65 ≥0.65 ≥0.65
Solder Float T288℃
(Soldering) 		- IPC TM-650
2.4.13 		≥30s ≥30s ≥30s ≥30s ≥30s ≥30s ≥30s
Coefficient Of Thermal Expansion X 100℃-
200℃ 		ppm/℃ TMA 16 16 16 16 16 16 16
Y 18 18 18 18 18 18 18
Z 30℃-150℃ 150 150 150 150 150 150 150
Heating Shrinka Method B % IPC TM-650
2.2.4 		±0.10 ±0.10 ±0.10 ±0.05 ±0.05 ±0.05 ±0.05
Method C
(150℃/0 5h) 		±0.20 ±0.20 ±0.20 ±0.15 ±0.15 ±0.15 ±0.15
Volume
Resistance		 - Ω *cm*10¹⁴ IPC-TM-650 2.24 6 6 6 6 6 6 6
Surface
Resistance		 - Ω*10¹⁰ IPC-TM-650 2.24 9 9 9 9 9 9 9
Relativ Permittivity 10GHz - SPDR 3.36 3.36 3.36 3.36 3.36 3.36 3.36
Dielectric Disspation Factor 10GHz - SPDR 0.0018 0.0018 0.0018 0.0018 0.0018 0.0018 0.0018